Semiconductor device and method of fabricating the same

ABSTRACT

A semiconductor device according to an embodiment of the present invention includes: a square pole-shaped channel portion made from a first semiconductor layer formed on a substrate, and surrounded with four side faces; a gate electrode formed on a first side face of the channel portion, and a second side face of the channel portion opposite to the first side face through respective gate insulating films; a source region having a conductivity type different from that of the channel portion and being formed on a third side face of the channel portion, the source region including a second semiconductor layer having a lattice constant different from that of the first semiconductor layer and being formed directly on the substrate; and a drain region having a conductivity type different from that of the channel portion and being formed on a fourth side face of the channel portion opposite to the third side face, the drain region including the second semiconductor layer being formed directly on the substrate.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromprior Japanese Patent Application No. 2006-126965, filed on Apr. 28,2006, the entire contents of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

The present invention relates to a semiconductor device having afin-shaped channel portion, and a method of fabricating the same.

Shrink is required for insulated gate field-effect transistors in orderto prevent a chip size from increasing along with high integration ofsemiconductor devices.

Cut-off characteristics of a drain current becomes worse because thedrain current becomes unable to be controlled any more by a gate voltagedue to a short channel effect as a gate length is shortened to make asource region and a drain region close to each other.

Therefore, even when a gate is closed, a leakage current is caused toflow between the source region and the drain region because silicon is asemiconductor having a relatively high electric conductivity. That is tosay, a phenomenon called punch-through occurs. A double-gate structuredfield effect transistor in which not only an upper surface of a channelportion, but also a lower surface thereof is held between oppositeportions of a gate electrode, thereby making it possible to perfectlycontrol a channel by a gate voltage applied to the gate electrode iseffective in suppression of the punch-through.

It is difficult to form a gate electrode on a lower surface of a channelportion in accordance with a conventional method of putting materialsone on top of another, thereby fabricating an insulating gatefield-effect transistor. In order to solve this problem, there is knowna double-gate structured field effect transistor structured such that achannel portion is stood vertically to a surface of a substrate, andboth sides of a fin-shaped channel portion is held between oppositeportions of a gate electrode (hereinafter referred to as “a FINFET”).The FINFET, for example, is disclosed in a non-patent literary documentof 2005 Symposium on VLSI Technology Digest of Technical Papers 11A-1,pp. 194 and 195.

For fabrication of the semiconductor device disclosed in the non-patentliterary document, a silicon layer is recess-etched in order to form asource region and a drain region of a FINFET, thereby leaving a part ofthe silicon layer, and a silicon germanium layer is epitaxially grown onthe part of the silicon layer thus left. A compressive stress isgenerated in a channel portion by the silicon germanium layer to givethe channel portion a strain, thereby increasing a mobility of carriers.

However, the semiconductor device disclosed in the non-patent literarydocument involves such a problem that a dispersion necessarily occurs ina thickness of the remaining silicon layer because there is no etchingstopper in the phase of the recess etching.

As a result, there is encountered such a problem that a total amount ofsilicon germanium layer disperses in correspondence to the thickness ofthe remaining silicon layer, so that the magnitude of the compressivestress generated in the channel portion fluctuates, and thus themobility of the carriers in the channel portion necessarily disperses.

Moreover, there is caused such a problem that the lower portion of thechannel portion contacts no silicon germanium layer because theremaining silicon layer underlies each of the source region and thedrain region, which results in that an amount of strain in the lowerportion of the channel portion decreases, thereby reducing the mobilityof the carriers in the lower portion of the channel portion.

BRIEF SUMMARY OF THE INVENTION

A semiconductor device according to one embodiment of the presentinvention includes:

a square pole-shaped channel portion made from a first semiconductorlayer formed on a substrate, and surrounded with four side faces;

a gate electrode formed on a first side face of the channel portion, anda second side face of the channel portion opposite to the first sideface through respective gate insulating films;

a source region having a conductivity type different from that of thechannel portion and being formed on a third side face of the channelportion, the source region including a second semiconductor layer havinga lattice constant different from that of the first semiconductor layerand being formed directly on the substrate; and

a drain region having a conductivity type different from that of thechannel portion and being formed on a fourth side face of the channelportion opposite to the third side face, the drain region including thesecond semiconductor layer being formed directly on the substrate.

A method of fabricating a semiconductor device according to anotherembodiment of the present invention includes:

processing a semiconductor layer laminated on a substrate, therebyforming a fin-shaped first semiconductor layer;

forming a gate electrode on parts of both side faces of the firstsemiconductor layer through respective gate insulating films;

forming sidewall films on regions, each having no gate electrode formedthereon, of the both side faces of the first semiconductor layer;

removing the first semiconductor layer until a surface of the substrateis exposed while a part of the first semiconductor layer is left betweenthe sidewall films; and

growing a second semiconductor layer from a surface of the part of thefirst semiconductor layer thus left to fill a gap defined between thesidewall films with the second semiconductor layer, thereby forming asource region and a drain region each having a conductivity typedifferent from that of the first semiconductor layer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view of a semiconductor device according to a firstembodiment of the present invention;

FIG. 2A is a cross sectional view taken on line A-A of FIG. 1;

FIG. 2B is a cross sectional view taken on line B-B of FIG. 1;

FIGS. 3A and 3B are respectively perspective views of the semiconductordevice according to the first embodiment of the present invention;

FIG. 4 is a conceptual view showing effects of the semiconductor deviceaccording to the first embodiment of the present invention;

FIG. 5 is a conceptual view showing effects of a conventionalsemiconductor device;

FIGS. 6 to 11 are respectively cross sectional views showing processesfor fabricating the semiconductor device according to the firstembodiment of the present invention in respective steps in a fabricationmethod;

FIGS. 12 and 13 are respectively perspective views showing processes forfabricating the semiconductor device according to the first embodimentof the present invention in respective steps in the fabrication method;

FIG. 14A is a cross sectional view showing a process for fabricating thesemiconductor device according to the first embodiment of the presentinvention in a corresponding stage in the fabrication method;

FIG. 14B is a partially enlarged view of a portion, of the semiconductordevice, surrounded with a circle C shown in FIG. 14A;

FIG. 15A is a cross sectional view showing a process for fabricating thesemiconductor device according to the first embodiment of the presentinvention in a corresponding stage in the fabrication method;

FIG. 15B is a partially enlarged view of a portion, of the semiconductordevice, surrounded with a circle D shown in FIG. 15A;

FIG. 16A is a cross sectional view showing a process for fabricating thesemiconductor device according to the first embodiment of the presentinvention in a corresponding stage in the fabrication method;

FIG. 16B is a partially enlarged view of a portion, of the semiconductordevice, surrounded with a circle E shown in FIG. 16A;

FIG. 17 is a perspective view showing a process for fabricating thesemiconductor device according to the first embodiment of the presentinvention in a corresponding stage in the fabrication method;

FIG. 18A is a cross sectional view showing a process for fabricating asemiconductor device according to a second embodiment of the presentinvention in a corresponding stage in a fabrication method;

FIG. 18B is a partially enlarged view of a portion, of the semiconductordevice, surrounded with a circle F shown in FIG. 18A;

FIG. 19A is a cross sectional view showing a process for fabricating thesemiconductor device according to the second embodiment of the presentinvention in a corresponding stage in the fabrication method;

FIG. 19B is a partially enlarged view of a portion, of the semiconductordevice, surrounded with a circle G shown in FIG. 19A;

FIG. 20A is a cross sectional view showing a process for fabricating thesemiconductor device according to the second embodiment of the presentinvention in a corresponding stage in the fabrication method;

FIG. 20B is a partially enlarged view of a portion, of the semiconductordevice, surrounded with a circle H shown in FIG. 20A;

FIG. 21 is a perspective view showing a process for fabricating thesemiconductor device according to the second embodiment of the presentinvention in a corresponding stage in the fabrication method;

FIG. 22A is a cross sectional view showing a process for fabricating asemiconductor device according to a third embodiment of the presentinvention in a corresponding stage in a fabrication method;

FIG. 22B is a partially enlarged view of a portion, of the semiconductordevice, surrounded with a circle I shown in FIG. 22A;

FIG. 23 is a plan view of a region of the part of the semiconductordevice shown in FIG. 22B when viewed from an upper part;

FIG. 24A is a cross sectional view showing a process for fabricating thesemiconductor device according to the third embodiment of the presentinvention in a corresponding stage in the fabrication method; and

FIG. 24B is a partially enlarged view of a portion, of the semiconductordevice, surrounded with a circle J shown in FIG. 24A.

DETAILED DESCRIPTION OF THE INVENTION

First to third embodiments of the present invention will be described indetail hereinafter with reference to the accompanying drawings.

Firstly, the first embodiment of the present invention will now bedescribed in detail with reference FIGS. 1 to 17. FIG. 1 is a plan viewof a semiconductor device according to the first embodiment of thepresent invention, FIG. 2A is across sectional view taken on line A-A ofFIG. 1, FIG. 2B is a cross sectional view taken on line B-B of FIG. 1,and FIGS. 3A and 3B are respectively perspective views of thesemiconductor device according to the first embodiment of the presentinvention.

As shown in FIG. 1, FIGS. 2A and 2B, and FIGS. 3A and 3B, asemiconductor device 10 of this embodiment is a p-channel FINFETincluding a substrate 14 having a base material 11 and an insulatinglayer 12 formed on the base material 11, a square pole-shaped channelportion 15 which is formed by processing a first semiconductor layer 13laminated on the insulating layer 12 of the substrate 14 and which issurrounded with first to fourth side faces 15 a, 15 b, 15 c and 15 dwhich are formed so as to be approximately vertical to a surface of thesubstrate 14, and a gate electrode 17 which is formed on the first sideface 15 a of the channel portion 15 and the second side face 15 b of thechannel portion 15 opposite to the first side face 15 a throughrespective gate insulating films 16 a and 16 b so as to straddle thechannel portion 15.

Moreover, the semiconductor device 10 of this embodiment includes asource region 19 which is formed on the third side face 15 c of thechannel portion 15, and which has second semiconductor layers 18 a and18 b which are formed directly on the insulating layer 12 of thesubstrate 14 and each of which has a conductivity type different fromthat of the first semiconductor layer 13, and a drain region 20 which isformed on a fourth side face 15 d of the channel portion 15 opposite tothe third side face 15 c, and which has second semiconductor layers 18 cand 18 d which are formed directly on the insulating layer 12 of thesubstrate 14 and each of which has the conductivity type different fromthat of the first semiconductor layer 13.

In addition, the second semiconductor layers 18 a and 18 b of the sourceregion 19 are formed along the first and second side faces 131 a and 132a of the first semiconductor layer 13 a, respectively.

Likewise, the second semiconductor layers 18 c and 18 d of the drainregion 20 are formed along the first and second side faces 131 b and 132b of the first semiconductor layer 13 b, respectively.

An insulating film 21 is formed on the channel portion 15, and each ofthe first semiconductor layers 13 a and 13 b, and an insulating film 22is formed on the gate electrode 17.

In addition, a sidewall film (not shown) is formed on each of side facesof the second semiconductor layers 18 a, 18 b, and 18 c, 18 d, and thegate electrode 17. A height of a vertex in cross section of the sidewallfilm formed on each of the side faces of the second semiconductor layers18 a, 18 b, and 18 c, 18 d is higher than a position of an upper surfaceof the insulating film 21 formed on each of the first semiconductorlayers 13 a and 13 b.

The substrate 14, and the first semiconductor layer 13 laminated on thesubstrate 14 have a separation by implantation of oxygen (SIMOX)structure in which for example, oxygen ions are implanted into a deepposition through a surface of a silicon substrate, and a heat treatmentis then performed at a high temperature, so that a silicon layer islaminated on the silicon substrate through a silicon oxide film.

Each of the second semiconductor layers 18 a, 18 b, and 18 c, 18 d ismade of a material having a lattice constant larger than that of thefirst semiconductor layer 13. For example, an n-type silicon (Si)crystal can be used as a material for the first semiconductor layer 13,and a p-type silicon germanium (hereinafter referred to as “SiGe”)crystal having a Ge concentration of about 10 to about 30 at % can beused as a material for each of the second semiconductor layers 18 a, 18b, and 18 c, 18 d.

A pattern of the channel region 15, the source region 19 and the drainregion 20 is formed by digging down the first semiconductor layer 13 onthe insulating layer 12 from its surface until the surface of theinsulating layer 12 is exposed. Hence, the heights of the channel region15, the source region 19 and the drain region 20 are approximately equalto one another, and for example, are set in the range of about 100 toabout 200 nm which approximately corresponds to a thickness of the firstsemiconductor layer 13.

A length (gate length) of the channel portion 15, for example, is in therange of about 20 to about 30 nm, and a width (gate width) thereof, forexample, is in the range of about 20 to about 30 nm.

A length of each of the source region 19 and the drain region 20, forexample, is about 100 nm, and a pad region (not shown) for electricalconnection to the outside is formed on a side of each of the sourceregion 19 and the drain region 20 opposite to the gate electrode 17.

The second semiconductor layers 18 a and 18 b of the source region 19,and the second semiconductor layers 18 c and 18 d of the drain region 20are strained because the lattice constant of each of them is larger thanthat of silicon. Thus, a tensile stress is generated as an internalstress in each of the second semiconductor layers 18 a, 18 b, and 18 c,18 d, and the second semiconductor layers 18 a, 18 b, and 18 c, 18 dexerts a compressive stress on the channel portion 15.

Reception of the compressive stress in the channel portion 15 results ina mobility of carriers, that is, holes in this embodiment beingincreased.

FIG. 4 is a conceptual view showing effects inherent in thesemiconductor device of this embodiment, and FIG. 5 is a conceptual viewshowing effects inherent in a conventional semiconductor device. Here,the conventional semiconductor device shown in FIG. 5 has a structure inwhich a silicon layer 26 is interposed between each of the secondsemiconductor layers 24 a and 24 c each being made of p-type SiGe havinga Ge concentration of about 10 to about 30 at %, and an insulating layer12 in all vertical cross sections of a source region 28 and a drainregion 29.

As shown in FIG. 4, in the semiconductor device 10 of this embodiment,each of the second semiconductor layers 18 a and 18 b of the sourceregion 19 is formed directly on the insulating layer 12 of the substrate14 in a state of contacting the third side face 15 c of the channelportion 15.

Likewise, each of the second semiconductor layers 18 c and 18 d of thedrain region 20 is formed directly on the insulating layer 12 of thesubstrate 14 in a state of contacting the fourth side face 15 d of thechannel portion 15.

As a result, the second semiconductor layers 18 a, 18 b, and 18 c, 18 dwhich are formed over a height range from the bases to the upsides ofthe first and second side faces 15 a and 15 b of the channel portion 15can exert approximately and uniformly a compressive stress 23 on thechannel portion 15 from its lower end portion to its upper end portion.

On the other hand, as shown in FIG. 5, in the conventional semiconductordevice, a second semiconductor layer 24 a is formed on the substrate 14through the silicon layer 26 which is left after completion of therecess etching. Likewise, the second semiconductor layer 24 c is formedon the substrate 14 through the silicon layer 26 which is left aftercompletion of the recess etching.

As a result, a magnitude of a compressive stress 27 which the secondsemiconductor layers 24 a and 24 c exert on the channel portion 25fluctuates due to a dispersion of a thickness, t, of the silicon layer26.

Moreover, no compressive stress 27 is exerted on a lower portion of thechannel portion 25 because the second semiconductor layers 24 a and 24 ceach of which is formed so as to be separated apart from the base of theside face of the channel portion 25 contact no lower portion of thechannel portion 25.

As has been described above, the semiconductor device of this embodimenthardly involves such a problem that a length of contact between each ofthe second semiconductor layers as the stain generating source and thechannel portion changes due to the dispersion of the thickness of eachof the second semiconductor layers, so that the magnitude of thecompressive stress exerted on the channel portion fluctuates and thusthe mobility of the carriers in the channel portion disperses.

As a result, it is possible to obtain the semiconductor device 10including the channel portion 15 having the sufficient mobility.

Note that, a total amount of second semiconductor layers 18 a, 18 b, and18 c, 18 d increases and thus the compressive stress exerted on thechannel portion 15 becomes large as a width of each of the secondsemiconductor layers 18 a, 18 b, and 18 c, 18 d is larger. Hence, awidth of each of the first semiconductor layers 13 a and 13 b is morepreferably thin as far as no problem is caused in terms of thefabrication.

Next, a method of fabricating the semiconductor device 10 of thisembodiment will now be described in detail with reference to FIGS. 6 to17. Here, each of cross sections shown in FIGS. 6 to 11, respectively,corresponds to that shown in FIG. 2A. In addition, each of crosssections shown in FIG. 14A, FIG. 15A and FIG. 16A, respectively,corresponds to that shown in FIG. 2B.

Firstly, the SIMOX substrate is prepared, and as shown in FIG. 6, aninsulating film, for example, a silicon nitride film 31 is formed on thefirst semiconductor layer 13 which, for example, is made of Si andlaminated on the substrate 14 by, for example, utilizing a plasmachemical vapor deposition (CVD) method. After that, a resist pattern 32which is used to pattern the first semiconductor layer 13 into a finshape is formed on the silicon nitride film 31 by utilizing aphotolithography method.

Next, as shown in FIG. 7, the silicon nitride film 31 is selectivelyetched away using the resist pattern 32 as a mask by, for example,utilizing a reactive ion etching (RIE) method, thereby forming aninsulating film 21 to which the resist pattern 32 is transcribed.

Next, as shown in FIG. 8, after the resist pattern 32 is removed, thefirst semiconductor layer 13 is selectively etched away until thesurface of the insulating layer 12 is exposed using the insulating film21 as a mask by, for example, utilizing the RIE method, thereby forminga fin-shaped active region 34.

Here, a central portion (a portion having an upper surface, and sidefaces on which the gate electrode 17 is intended to be formed throughthe insulating film 21, and the gate insulating films 16 a and 16 b,respectively) of the active region 34 is a region which is intended tobecome the channel portion 15 of the p-channel FINFET, and both sides ofthe active region 34 are regions which are intended to become the sourceregion 19 and the drain region 20, respectively.

Next, as shown in FIG. 9, a silicon oxide film 35 having a thickness ofabout 2 nm is formed on each of the both sides of the active region 34by, for example, performing thermal oxidation. After that, a polysiliconfilm 36 having a thickness of about 100 to about 500 nm is formed overthe substrate 14 including the active region 34 by, for example,utilizing the CVD method.

Next, as shown in FIG. 10, an insulating film 22 which, for example, ismade of tetraethyl ortho silicate (TEOS) is formed on the polysiliconfilm 36, a resist pattern 38 is formed on the insulating film 22 byutilizing the photolithography method, and the pattern concerned istranscribed to the insulating film 22 using the resist pattern 38 as amask.

Next, as shown in FIG. 11, after the resist pattern 38 is removed, thepolysilicon film 36 is selectively etched away using the insulating film22 as a mask by, for example, utilizing the RIE method, thereby formingthe gate electrode 17. Here, a region of the active region 34 having anupper surface, and both side faces which are surrounded with the gateelectrode 17 is intended to become the channel portion 15, and a regionother than the region intended to become the channel portion 15 isintended to become the first semiconductor layers 13 a and 13 b. Inaddition, portions of the silicon oxide film 35 which contact the gateelectrode 17 are intended to become the gate insulating films 16 a and16 b, respectively.

After that, although the silicon oxide film 35 formed on each of theside faces of the first semiconductor layers 13 a and 13 b, that is, thesilicon oxide film 35 other than the portion which is intended to becomeeach of the gate insulating films 16 a and 16 b is removed in theetching process, it may not be removed, but be left.

Next, as shown in FIG. 12, a silicon oxide film 40 is formed over thesubstrate 14 including the gate electrode 17 and the active region 34.

Next, as shown in FIG. 13, the silicon oxide film 40 is anisotropicallyetched by, for example, utilizing the RIE method, which results in thatthe sidewall films 40 a are formed on side faces of the firstsemiconductor layers 13 a and 13 b, respectively, and sidewall films 40b are formed on side faces of the gate electrode 17, respectively.

Next, as shown in FIGS. 14A and 14B, the insulating film 21 is slimmedby, for example, utilizing a wet etching using a thermal phosphoricacid. Here, FIG. 14B is a partially enlarged view of a portionsurrounded with a circle C in FIG. 14A.

Next, as shown in FIGS. 15A and 15B, unmasked regions of the firstsemiconductor layers 13 a and 13 b are selectively etched away until thesurface of the insulating layer 12 of the substrate 14 is exposed usingthe slimmed insulating film 21 as a mask by, for example, utilizing theRIE method, thereby leaving a region underlying the slimmed insulatingfilm 21. Here, FIG. 15B is a partially enlarged view of a portionsurrounded with a circle D in FIG. 15A.

As a result, gaps 43 are defined between the sidewall films 40 a, andthe first semiconductor layers 13 a and 13 b thus left.

Next, as shown in FIGS. 16A and 16B, a p-type SiGe crystal having a Geconcentration of about 10 to about 30 at % is epitaxially grown usingeach of the first semiconductor layers 13 a and 13 b as a growthsubstrate by utilizing a selective epitaxial growth method using a rawmaterial gas of silane (SiH₄) and german (GeH₄) containing boron (B)added thereto, for example, a molecular beam epitaxy (MBE) method. As aresult, each of gaps 43 is filled with the p-type SiGe crystal. Here,FIG. 16B is a partially enlarged view of a portion surrounded with acircle E in FIG. 16A.

As a result, the second semiconductor layers 18 a and 18 b are formed onthe side faces of the first semiconductor layer 13 a, respectively, andthe second semiconductor layers 18 c and 18 d are formed on the sidefaces of the first semiconductor layer 13 b, respectively.

As a result, the source region 19 having the second semiconductor layers18 a and 18 b which are formed directly on the insulating layer 12 ofthe substrate 14 along the first and second side faces 131 a and 132 aof the first semiconductor layer 13 a is formed on the third side face15 c of the channel portion 15 shown in FIG. 1.

Likewise, the drain region 20 having the second semiconductor layers 18c and 18 d which are formed directly on the insulating layer 12 of thesubstrate 14 along the first and second side faces 131 b and 132 b ofthe first semiconductor layer 13 b is formed on the fourth side face 15d of the channel portion 15 shown in FIG. 1.

FIG. 17 shows the state at this time. Note that, a figure in whichillustration of the sidewall films 40 a and 40 b shown in FIG. 17 isomitted corresponds to FIG. 3A.

As has been described so far, in this embodiment, the firstsemiconductor layers 13 a and 13 b each being made of Si or the like ispatterned so that each of central portions of the first semiconductorlayers 13 a and 13 b is left, and the second semiconductor layers 18 a,18 b, and 18 c, 18 d each being made of the SiGe crystal or the like areepitaxially grown by using each of the first semiconductor layers 13 aand 13 b thus left as the growth substrate.

As a result, the semiconductor layers 18 a, 18 b, and 18 c, 18 d whichare approximately equal in thickness to one another and which are lessin dispersion can be formed directly on the insulating layer 12 of thesubstrate 14.

Therefore, the compressive stress which each of the second semiconductorlayers 18 a, 18 b, and 18 c, 18 d exerts, respectively, on the channelportion 15 is approximately constant, and thus the strain can be givento even the lower end portion of the channel portion 15.

Consequently, it is possible to obtain the semiconductor device 10including the channel portion 15 having the sufficient carrier mobility.

Note that, although the case where the semiconductor device 10 is thep-channel FINFET has been described so far in this embodiment, thesemiconductor device 10 may also be an n-channel FINFET.

In this case, a crystal having a lattice constant smaller than that ofeach of the first semiconductor layers is used as the material for eachof the second semiconductor layers. For example, each of the firstsemiconductor layers is made of p-type silicon, and also n-type Si:Cwhich contains therein carbon (C) of about 1 to about 3 at % and whichis doped with arsenic (As), for example, can be used as the material foreach of the second semiconductor layers.

Si:C, for example, can be formed by utilizing a chemical vapordeposition method using a mixed gas of silane (SiH₄) and methane (CH₄)as the raw material gas.

Si:C is strained because of its smaller lattice constant than that ofsilicon, and a compressive stress is generated in Si:C as the internalstress to exert a tensile stress on the channel portion 15. The channelportion 15 receives the tensile stress, thereby increasing the mobilityof the carriers, that is, the electrons in this case.

In addition, although the case where each of the second semiconductorlayers 18 a, 18 b, and 18 c, 18 d is epitaxially grown by utilizing theMBE method has been described so far, any other suitable selectivegrowth method, for example, an ultra high vacuum chemical vapordeposition (UHVCVD) method may also be used.

FIGS. 18A and 18B to FIGS. 20A and 20B are respectively cross sectionalviews showing processes for fabricating a semiconductor device accordingto a second embodiment of the present invention in respective stages ina fabrication method, and FIG. 21 is a perspective view showing aprocess for fabricating the semiconductor device according to the secondembodiment of the present invention in a corresponding stage in thefabrication method. In this embodiment, the same constituent elements asthose in the first embodiment are designated with the same referencenumerals, respectively, and a description thereof is omitted here forthe sake of simplicity. Thus, only a different point is described now.

The semiconductor device of this embodiment is different from that ofthe first embodiment in shape of each of the first semiconductor layers13 a and 13 b.

That is to say, in the method of fabricating the semiconductor device ofthis embodiment, firstly, the sidewall film 40 a is formed on each ofthe side faces of the first semiconductor layers 13 a and 13 b inaccordance with the processes shown in FIGS. 6 to 13, respectively.

Next, as shown in FIGS. 18A and 18B, the insulating film 21 formed oneach of the first semiconductor layers 13 a and 13 b is removed by, forexample, utilizing the wet etching using a thermal phosphoric acid,thereby exposing the upper surfaces of the first semiconductor layers 13a and 13 b. Here, FIG. 18B is a partially enlarged view of a portionsurrounded with a circle F in FIG. 18A.

Next, as shown in FIGS. 19A and 19B, the first semiconductor layers 13 aand 13 b are anisotropically etched under the condition that a gaspressure is set as about 40 mTorr or more, and a bias power is set asabout 150 W or less by, for example, utilizing the RIE method using amixed gas of a chlorine gas, an oxygen gas and a nitrogen gas(Cl₂/O₂/N₂). Here, FIG. 19B is a partially enlarged view of a portionsurrounded with a circle G in FIG. 19A.

Since an etching rate of each of the first semiconductor layers 13 a and13 b is high in the side of each of the sidewall films 40 a and low in acentral portion, the surface of the insulating film 12 on a side of eachof the sidewall films 40 a can be first exposed.

The etching utilizing the RIE method is completed at a time point whenthe surface of the insulating film 12 on the side of each of thesidewall films 40 a is first exposed, which results in that centrallower end portions of the first semiconductor layers 13 a and 13 b arenot etched away, but left, and each of them has a rod-like shapeextending in a direction along each of the sidewall films 40 a on theinsulating layer 12.

Next, as shown in FIGS. 20A and 20B, a second semiconductor layer 52made of a p-type SiGe crystal containing boron (B) having a Geconcentration of about 10 to about 30 at % added thereto is epitaxiallygrown with each of the first semiconductor layers 13 a and 13 b thusleft as a growth nucleus, thereby filling a gap 51 with the secondsemiconductor layer 52 from the insulating layer 12 of the substrate 14.Here, FIG. 20B is a partially enlarged view of a portion surrounded witha circle H in FIG. 20A.

As a result, as shown in FIG. 21, it is possible to obtain asemiconductor device 53 including the source region 19 and the drainregion 20 which are formed on the third and fourth side faces 15 c and15 d of the channel portion 15, respectively, and each of which has thesecond semiconductor layer 52 made of the p-type SiGe crystal. In thiscase, opposite portions of the second semiconductor layer 52 are formeddirectly on the insulating layer 12 of the substrate 14 so as to holdthe gate electrode 17 between them. Note that, illustration of thesidewall films 40 a and 40 b is omitted in FIG. 21.

As has been described so far, in this embodiment, each of the firstsemiconductor layers 13 a and 13 b is formed in rod-like shape having alow height. As a result, this embodiment has such an advantage thatsince a large opening area is obtained in the gap 51, it is easy to fillthe gap 51 with the second semiconductor layer 52 with each of the firstsemiconductor layers 13 a and 13 b as the growth nucleus.

FIGS. 22A and 22B, and FIGS. 24A and 24B are respectively crosssectional views showing processes for fabricating a semiconductor deviceaccording to a third embodiment of the present invention in respectivestages in a fabrication method, and FIG. 23 is a plan view of a regionof a part of the semiconductor device shown in FIG. 22B when viewed froman upper part. In this embodiment, the same constituent elements asthose in the first embodiment are designated with the same referencenumerals, respectively, and a description thereof is omitted here forthe sake of simplicity. Thus, only a different point is described now.

The semiconductor device of this embodiment is different from that ofthe first embodiment in that a plurality of semiconductor layers 13 aand 13 b each having a protrusion shape are formed on the insulatingfilm 12 so as to be separated apart from one another.

That is to say, according to a method of fabricating the semiconductordevice of this embodiment, firstly, the sidewall film 40 a is formed oneach of the side faces of the first semiconductor layers 13 a and 13 bin accordance with the processes shown in FIGS. 6 to 13, respectively,and the insulating film 21 formed on each of the first semiconductorlayers 13 a and 13 b is removed in accordance with the process shown inFIGS. 18A and 18B, thereby exposing the upper surfaces of the firstsemiconductor layers 13 a and 13 b.

Next, the upper end portions of the first semiconductor layers 13 a and13 b are anisotropically etched (first anisotropic etching process) to adepth of about ⅔ or less of the full depth by, for example, utilizingthe RIE method.

Next, as shown in FIGS. 22A and 22B, and FIG. 23, the firstsemiconductor layers 13 a and 13 b are anisotropically etched (secondanisotropic etching process) until the surface of the insulating layer12 is exposed under the condition that an oxygen ratio (O₂/(HBr+O₂)) isnot lower than about 5 vol %, a gas pressure is not lower than 20 mTorr,and a bias power is not higher than about 100 W by, for example,utilizing the RIE method using a mixed gas (HBr/O₂) of a hydrogenbromide gas and an oxygen gas. Here, FIG. 22B is a partially enlargedview of a portion surrounded with a circle I in FIG. 22A, and FIG. 23 isa plan view of the region shown in FIG. 22B when viewed from an upperpart.

The etching deposit is more in the condition for the second anisotropicetching process than in the condition for the first anisotropic etchingprocess. Thus, a silicon compound (for example, Si_(x)Br_(x)O_(y)) whichdiffuses into the plasma in the etching process is re-dissociated to bediscretely educed on the first semiconductor layers 13 a and 13 b whichare being etched.

Since each of the silicon compounds 60 thus educed acts as an etchingmask, the regions of the first semiconductor layers 13 a and 13 bunderlying the silicon compounds 60 are not etched away, but left inisland shape.

Next, as shown in FIGS. 24A and 24B, a second semiconductor layer 63made of a p-type SiGe crystal containing boron (B) added thereto andhaving a Ge concentration of about 10 to about 30 at % is epitaxiallygrown with each of the first semiconductor layers 13 a and 13 b left inisland shape as a growth nucleus, thereby filling a gap 62 with thesecond semiconductor layer 63 from the insulating layer 12 of thesubstrate 14. Here, FIG. 248 is partially enlarged view of a portionsurrounded with a circle J in FIG. 24A.

As has been described so far, in this embodiment, each of the firstsemiconductor layers 13 a and 13 b is formed in the form of a pluralityof low protrusions which are disposed in island shape.

As a result, this embodiment has such an advantage that since a largeopening area is obtained in the gap 62, it is easy to fill the gap 62with the second semiconductor layer 63 with each of the firstsemiconductor layers 13 a and 13 b as the growth nucleus.

It should be noted that the present invention is not intended to belimited to the above-mentioned first to third embodiments, and thevarious kinds of changes thereof can be implemented by those skilled inthe art without departing from the gist of the invention. For example,although the case where the semiconductor device is fabricated by usingthe SIMOX substrate as the substrate has been described so far in eachof the above-mentioned first to third embodiments, the present inventionis not limited thereto. That is to say, for example, a silicon oninsulator (SOI) substrate may also be used which is obtained in suchaway that two sheets of silicon substrates are stuck to each otherthrough a silicon oxide film, and one silicon substrate is thinned in apolishing process.

Moreover, a so-called pn junction isolation substrate may also be usedin which an isolation layer having a conductivity type opposite to thatof a silicon substrate, and a well region having the same conductivitytype as that of the silicon substrate are formed on the siliconsubstrate.

In the pn junction isolation substrate as well, the digging-down isperformed from a surface of the well layer to the isolation layer,thereby enabling the FINFET to be formed similarly to the case of theSOI substrate or the like.

In addition, in the second and third embodiments, as described in thefirst embodiment, the semiconductor device can be fabricated in the formof the n-channel FINFET, or each of the second semiconductor layers maybe grown by utilizing a suitable method other than the MBE method.

In addition, the constituent elements of the above-mentioned embodimentscan be arbitrarily combined with each other without departing from thegist of the invention.

1.-13. (canceled)
 14. A method of fabricating a semiconductor device,comprising: processing a semiconductor layer laminated on a substrate,thereby forming a fin-shaped first semiconductor layer; forming a gateelectrode on parts of both side faces of the first semiconductor layerthrough respective gate insulating films; forming sidewall films onregions, each having no gate electrode formed thereon, of the both sidefaces of the first semiconductor layer, removing the first semiconductorlayer until a surface of the substrate is exposed while a part of thefirst semiconductor layer is left between the sidewall films; andgrowing a second semiconductor layer from a surface of the part of thefirst semiconductor layer thus left to fill a gap defined between thesidewall films with the second semiconductor layer, thereby forming asource region and a drain region each having a conductivity typedifferent from that of the first semiconductor layer.
 15. A method offabricating a semiconductor device according to claim 14, wherein thefirst semiconductor layer is removed so that a portion of the firstsemiconductor layer located in a region in a vicinity of a centerbetween the sidewall films is left in plate shape.
 16. A method offabricating a semiconductor device according to claim 15, wherein thefirst semiconductor layer is removed in an etching process using anetching mask.
 17. A method of fabricating a semiconductor deviceaccording to claim 14, wherein the first semiconductor layer is removedso that a portion of the first semiconductor layer located in a regionin a vicinity of the surface of the substrate in a region in a vicinityof a center between the sidewall films is left in rod shape.
 18. Amethod of fabricating a semiconductor device according to claim 17,wherein the first semiconductor layer is removed in an anisotropicetching process.
 19. A method of fabricating a semiconductor deviceaccording to claim 14, wherein the first semiconductor layer is removedso that a portion of the first semiconductor layer located in a regionin a vicinity of the surface of the substrate is left in a form of aplurality of protrusions.
 20. A method of fabricating a semiconductordevice according to claim 19, wherein the first semiconductor layer isremoved such that an upper portion of the first semiconductor layer isremoved in a first anisotropic etching process, and a lower portion ofthe first semiconductor layer is removed in a second anisotropic etchingprocess performed under a condition that an etching deposit is more inthe second anisotropic etching process than in the first anisotropicetching process.